CIXIN MACHINERY TECHNOLOGY
Dual‑Block Fan‑Assisted Heat Sink Assembly
A compact, high-performance passive heat sink engineered for electronic devices that demand consistent and efficient thermal control. The precision-machined aluminum fin array maximizes heat dissipation in tight spaces, showcasing advanced capabilities in Heat Sink Manufacturing.
- Service Focus: Heat Sink Manufacturing
- Tipo de refrigeración: Passive airflow
- Material: Aluminum fin array with metal support hardware
- Diseño: Flat compact fin structure for maximum surface contact
- Custom Options: Fin spacing, base dimensions, and mounting features
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This dual-block fan-assisted heat sink module provides efficient thermal control for electronic components in compact enclosures. Two aluminum fin blocks are positioned to maximize heat dissipation surface, while integrated fans drive airflow through the fins to maintain stable operating temperatures.
The module is engineered with precision alignment and robust mounting points, ensuring structural stability and ease of installation. Fin spacing and airflow channels are optimized for effective heat transfer.
Flexible customization allows adjustments to fan orientation, fin density, and module dimensions, enabling the module to meet diverse thermal requirements. The design supports high-performance electronics, industrial automation modules, LED systems, Dispositivos de comunicación, and automotive electronics, balancing compact size with reliable cooling performance.
| Parámetro | Detalles |
| Tipo de refrigeración | Passive airflow |
| Material | Aluminio (6061 / 6063) |
| Fin Height | 35 milímetro |
| Fin Thickness | 1.2 milímetro |
| Base Thickness | 5 milímetro |
| Dimensiones generales | 120 × 90 × 35 milímetro (L × W × H) |
| Acabado superficial | Natural aluminum / anodized optional |
| Resistencia térmica | 0.25 °C/W (approx.) |
| Mounting | Screw holes / base mounting points |
| Producción | Prototipo, Lotes pequeños, or volume |
- Electrónica: Thermal management for compact control boards and power modules
- Equipamiento industrial: Embedded automation electronics
- LED Systems: Passive cooling for high-power LED devices
- Communication Devices: Network modules and telecom electronics
- Automotive Electronics: Heat management for control units and power electronics
1. Why is this categorized under Heat Sink Manufacturing?
It demonstrates the production of high-performance passive thermal modules with precise fin alignment and structural stability.
2. Can the module be customized?
Sí. Fin spacing, base dimensions, and mounting features can be tailored to customer requirements.
3. Is small-batch production supported?
Sí. Prototipo, Lotes pequeños, and volume production are available.
4. Which industries typically use this module?
Electrónica, industrial automation, LED systems, Dispositivos de comunicación, and automotive electronics.
5. Qué materiales se utilizan?
Aluminum for fins with metal hardware for structural support.
