CIXIN MACHINERY TECHNOLOGY
High-Performance Fin Array Heat Sink Module
A dense aluminum fin heat sink designed for efficient thermal dissipation in high-power electronic devices.
- Fin Density Optimization: Designed to maximize airflow and heat transfer efficiency.
- Rendimiento de materiales: Made from high-grade aluminum for excellent thermal conductivity.
- Precisión dimensional: Precision fabrication ensures consistent fin spacing and flatness.
- Factor de forma compacto: Optimized for tight electronic enclosures.
- Producción escalable: Suitable for both prototyping and medium-volume production runs.
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- Descripción
- Especificación
- Aplicación
- Preguntas frecuentes
This high-performance fin array heat sink is engineered to provide exceptional cooling for high-power electronics, ensuring thermal stability and reliable operation. The tightly spaced aluminum fins maximize surface area for heat transfer, while the solid base plate ensures uniform heat distribution.
The component is optimized for high-efficiency airflow, allowing integration into compact enclosures without compromising cooling performance. Advanced fabrication processes maintain precise fin spacing and flatness, providing consistent thermal contact and minimizing hotspots.
| Parámetro | Especificación |
| Material | Aluminio 6061 / 6063 |
| Fin Density | 25–40 fins per inch (personalizable) |
| Base Plate Thickness | 5–12 mm |
| Fin Height | 20–50 mm |
| Fin Thickness | 0.3–0.6 mm |
| Max Workpiece Size | 200 × 100 × 50 milímetro |
| Acabado superficial | Mill finish / optional anodizing |
| Tolerancia de procesos | ±0,05 mm |
| Carreras en lote | Prototype → Small batch → Medium volume |
| Tiempo de espera | 7–12 working days depending on complexity |
- Power Electronics: High-power modules and converters.
- Equipamiento industrial: Cooling for control systems and drives.
- Communication Devices: Thermal management for transmitters and servers.
- LED Systems: Heat dissipation for high-intensity LED arrays.
Q1: What materials can be used for this heat sink?
Standard aluminum alloys (6061, 6063) se utilizan, with optional anodizing for enhanced durability.
P2: Can the fin height and spacing be customized?
Sí, fin geometry can be tailored for specific thermal performance and enclosure constraints.
P3: What production volumes are supported?
This heat sink can be produced from prototypes up to medium-volume production runs.
P4: How precise is the fin alignment and base flatness?
CNC fabrication maintains ±0.05 mm tolerance for both fin spacing and base flatness.
P5: Is additional surface treatment available?
Sí, anodizing or powder coating can be applied for improved corrosion resistance and aesthetic finish.
