CIXIN MACHINERY TECHNOLOGY
Multi-Heat-Pipe Segment Heat Sink Module
A high-performance multi-segment heat sink with integrated copper heat pipes, engineered for electronic devices with concentrated heat sources. Its staggered fin design and segmented thermal paths ensure rapid heat transfer and efficient dissipation, reflecting advanced Heat Sink Manufacturing capabilities.
- Service Focus: Heat Sink Manufacturing
- Tipo de refrigeración: Passive heat dissipation via copper heat pipes
- Experiencia en materiales: Aluminum fins and copper heat pipes
- Design Feature: Segmented fin blocks for optimized airflow and heat conduction
- Personalizable: Fin spacing, heat pipe arrangement, base thickness, and mounting configuration
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This multi-heat-pipe segment heat sink module is designed to efficiently manage thermal loads in compact electronic assemblies. The staggered aluminum fin arrays are connected to embedded copper heat pipes, forming multiple thermal pathways that distribute heat evenly and reduce hot spots.
The modular segment design allows precise integration with devices where space and airflow are constrained, while the copper heat pipes accelerate heat transfer from the base to the fin surfaces. Structural mounting points ensure stable assembly and reliable contact with the heat-generating components.
This heat sink demonstrates CIXIN’s ability to deliver customized thermal solutions that combine passive heat transfer efficiency with mechanical stability, suitable for high-density electronics, industrial control modules, communication systems, LED lighting arrays, and automotive electronic units.
| Parámetro | Detalles |
| Tipo de refrigeración | Passive cooling with multi-segment copper heat pipes |
| Material | Aluminum fins, copper heat pipes, metal mounting hardware |
| Fin Height | 25 milímetro |
| Fin Thickness | 1.0 milímetro |
| Base Thickness | 6 milímetro |
| Heat Pipe Diameter | 6 milímetro (×4 pipes) |
| Dimensiones generales | 150 × 70 × 30 milímetro (L × W × H) |
| Resistencia térmica | ~0.28 °C/W (typical for high-power module) |
| Mounting | Screw holes / base mounting pins |
| Producción | Prototipo, Lotes pequeños, or volume |
- Electrónica: High-density power boards and control modules
- Equipamiento industrial: Embedded controllers and automation modules
- LED Systems: High-power LED arrays requiring uniform heat dissipation
- Communication Devices: Network and telecom hardware
- Automotive Electronics: Heat management for vehicle power units and control systems
1. What is the main advantage of this heat sink design?
Segmented fins with copper heat pipes create multiple thermal paths, improving heat distribution and reducing hot spots.
2. Can the module be customized for different devices?
Sí. Fin arrangement, heat pipe placement, base thickness, and overall dimensions can be adapted to fit specific thermal requirements.
3. Is small-batch production supported?
Sí, prototipos, Pequeños lotes, and volume production are all supported.
4. Which industries typically use this solution?
Electrónica, industrial automation, LED systems, Dispositivos de comunicación, and automotive electronics.
5. Qué materiales se utilizan?
Aluminum for the fin arrays and copper for the heat pipes, ensuring efficient thermal conductivity.
