CIXIN MACHINERY TECHNOLOGY
Fan-Cooled Heat Sink Module
This fan-cooled heat sink module is designed for compact electronic equipment that requires stable thermal control in limited space. It combines an aluminum heat sink base, copper heat transfer sections, a metal mounting plate, and an integrated cooling fan to support efficient heat dissipation during continuous operation.
- Main Service: Heat Sink Manufacturing
- Cooling Type: Active air cooling with fan
- Material: Aluminum, copper, and metal hardware
- Supporting Processes: CNC milling, stamping, turning, surface finishing, and assembly
- Structure: Heat sink base, copper thermal section, mounting plate, screws, springs, and fan
- Custom Options: Size, hole position, fan model, fin structure, base thickness, and surface finish
- Suitable For: Electronics, communication equipment, LED devices, power modules, and industrial systems
- Description
- Specification
- Application
- FAQS
This fan-cooled heat sink module is a custom thermal management component for electronic products with high heat dissipation requirements. Compared with a passive heat sink, the integrated fan increases airflow across the heat sink surface and helps the device maintain a more stable operating temperature.
The module uses a compact multi-part structure. The aluminum heat sink body forms the main cooling section, while the copper thermal sections support heat transfer from the heat source to the dissipation area. The bottom metal plate provides mounting support, and the fan is fixed above the heat sink to create forced airflow through the fin structure.
As a Heat Sink Manufacturing Case, this product focuses on thermal transfer, airflow guidance, mounting stability, and reliable assembly. The manufacturing process covers heat sink machining, mounting plate forming, hole drilling, tapping, surface finishing, and final assembly of the fan, screws, springs, and related hardware.
This heat sink module can be produced according to customer drawings, samples, or thermal design requirements. Its structure can be adjusted for size, mounting holes, fan position, fin layout, copper section, and surface finish. It is suitable for electronics, communication modules, LED equipment, power supplies, and industrial control devices that require compact and stable cooling performance.
| Parameter | Value / Description |
| Main Service | Heat Sink Manufacturing |
| Cooling Type | Fan-assisted air cooling |
| Material Type | Aluminum, copper, and metal hardware |
| Surface Finish | Anodizing, plating, brushing, or custom finish |
| Manufacturing Type | Custom heat sink module production |
- Communication Equipment: Cooling modules for signal devices, network systems, and telecom hardware.
- Electronics: Heat dissipation for compact electronic assemblies, control boards, and power devices.
- Industrial Equipment: Thermal control for automation modules, controllers, and machine-mounted electronics.
- LED Equipment: Cooling support for high-power LED lights, lighting modules, and driver systems.
- Medical Devices: Heat sink assemblies for testing instruments, monitoring equipment, and precision electronic modules.
- Automotive Electronics: Cooling components for vehicle control units, power modules, and new energy systems.
1. What is a fan-cooled heat sink module?
A fan-cooled heat sink module is a thermal management component that combines a metal heat sink with a cooling fan. The heat sink transfers heat away from the component, while the fan increases airflow to improve cooling efficiency.
2. Why is this product classified under Heat Sink Manufacturing Cases?
Because the main function of this product is heat dissipation. Although it may involve CNC milling, turning, stamping, surface finishing, and assembly, these are supporting processes. The core category is still Heat Sink Manufacturing.
3. Can the heat sink size and fan model be customized?
Yes. The overall size, fan model, mounting holes, fin structure, copper section, base thickness, and surface finish can be customized according to drawings or samples.
4. What materials are commonly used?
Aluminum and copper are commonly used. Aluminum is often selected for the heat sink body because it is lightweight and easy to process. Copper can be used in key thermal transfer areas when higher heat conductivity is required.
5. What files are needed for quotation?
Usually, 2D drawings, 3D files, material requirements, surface finish requirements, quantity, tolerance requirements, and assembly details are needed. A sample can also be used for evaluation when drawings are not available.
6. Can this product be made in small batches?
Yes. This type of heat sink module can support prototype development, small batch orders, and batch production after structure and performance confirmation.