CIXIN MACHINERY TECHNOLOGY
Gold-Plated SMD IC Package Chip
- Manufacturing Method: Lead Frame Stamping + Plastic Encapsulation + Gold Electroplating Surface Treatment
- Material: Alloy Copper Lead Frame, Black Epoxy Molding Compound, Nickel Underlayer + Hard Gold Plating
- Lead Time: 3 working days
- Tolerance: ±0.06mm
- Post-treatment: Lead frame stamping, epoxy molding, deburring, degreasing activation, nickel pre-plating, hard gold electroplating, forming & trimming, electrical parameter testing
- Structure Feature: Bent gull-wing gold-plated SMD pins, large central gold-plated thermal pad, sealed black epoxy plastic body, positioning mark for PCB mounting
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- Description
- Specification
- Application
- FAQS
This spring loaded pogo pin is a precision elastic conductive connector designed for intermittent electrical contact testing and equipment signal docking. The entire brass body and contact tip undergo professional full gold electroplating process with nickel underlayer pre-treatment, which greatly enhances coating adhesion. The thick hard gold plating layer effectively resists oxidation, humidity corrosion and abrasion from thousands of repeated compression cycles, maintaining stable ultra-low contact resistance to avoid signal interruption during continuous testing and docking.
This SMD packaged IC chip is a mainstream surface-mount semiconductor component for circuit board assembly. Its gull-wing pins and central heat-conducting pad are processed by professional gold electroplating craft with nickel underlayer pre-treatment to boost coating adhesion. Thick hard gold plating effectively blocks oxidation and sulfide corrosion in long-term storage and high-temperature working environments, maintains ultra-low contact resistance during soldering and operation, and ensures stable signal transmission and efficient heat conduction via the central gold thermal pad.
The bent gull-wing pin design fits standard SMT reflow soldering processes, and the large-area gold-plated thermal pad quickly dissipates chip internal heat to avoid overheating failure. Bare copper or tin-plated lead frames tend to oxidize and generate poor solderability after storage; ordinary nickel plating cannot meet long-life high-reliability industrial semiconductor standards. We combine lead frame precision stamping, epoxy plastic encapsulation and gold electroplating into a complete production flow. All conductive metal areas go through multi-stage ultrasonic cleaning and surface activation before plating to eliminate missing plating or coating peeling defects. After electroplating, each chip undergoes forming trimming and full electrical performance inspection to guarantee reliable soldering matching with PCB gold finger boards and connectors. When customers adjust chip pin count or thermal pad size, we only optimize lead frame stamping molds and synchronously adjust electroplating parameters to match new electronic control equipment iterations.
| Item | Specification |
|---|---|
| Core Craft | Copper Alloy Lead Frame Stamping + Epoxy Encapsulation + Gold Electroplating |
| Raw Material | Alloy Copper Lead Frame, UL94 V-0 Black Epoxy Compound, Nickel Base + Hard Gold Plating |
| Dimensional Tolerance | ±0.06 mm |
| Minimum Gold Thickness on Pins & Thermal Pad | 0.7μm Hard Gold |
| Delivery Cycle | 3 working days after drawing confirmation |
| Available Post Finish | Full pin & pad gold plating, selective thickened gold plating, laser marking model numbers |
| Electrical & Anti-Corrosion Performance | Contact resistance ≤4mΩ, passes 72-hour neutral salt spray test, stable solderability after 1-year storage |
Q1: Can gold-plated IC pins maintain good solderability after long-term storage?
Our hard gold electroplated pins have excellent anti-tarnish performance, no oxidation discoloration under normal sealed storage for over 12 months, and support standard tin-lead or lead-free reflow soldering without poor wetting. For high-humidity storage scenarios, we can increase gold thickness up to 1.1μm.
Q2: Can we laser print custom chip model numbers on the epoxy plastic surface after gold plating?
Yes. Laser marking is available after gold electroplating, customized part numbers, lot codes and brand logos can be etched on the black epoxy package body without damaging internal gold plating layers.
Q3: How fast can revised pin layout IC packages be produced after drawing changes?
No extra waiting cycle for electroplating process adjustment. After new lead frame CAD drawings are confirmed, stamping, encapsulation and gold plating processes can all be finished within 2–3 working days.
Q4: Is gold electroplating suitable for small batch prototype or mass production chips?
Gold-plated IC packages are preferred for high-reliability prototype samples and small-batch industrial/automotive orders. For consumer electronics mass production over 100,000 units, immersion tin plating is more cost-effective for long-term bulk supply.
Q5: Will the gold plating layer peel off during high-temperature reflow soldering?
We adopt multi-step pre-treatment and intermediate nickel barrier layer to strengthen bonding force between gold and copper substrate. 100% visual inspection after plating ensures complete, crack-free gold coverage on all pins and thermal pads, resisting peak reflow temperature up to 260°C without coating detachment.
Q6: Can silver electroplating replace gold plating for high-frequency radio frequency chips?
Absolutely. We support silver electroplating surface finishing as an alternative craft for high-frequency RF semiconductor components after prototype verification of gold-plated IC packages.
