CIXIN MACHINERY TECHNOLOGY
Gold Plated Edge Finger PCB Circuit Board
Manufacturing Method: FR-4 PCB Etching + Drilling + Solder Mask Printing + Edge Finger Gold Electroplating
- Material: FR-4 Substrate, Copper Foil, Green Solder Mask, Nickel Underlayer + Hard Gold Plating
- Lead Time: 3 working days
- Tolerance: ±0.08mm
- Post-treatment: Drilling, circuit etching, solder mask coating, surface activation, nickel pre-plating, hard gold electroplating, routing, electrical testing
- Structure Feature: Uniform gold-plated edge contact fingers, pre-drilled mounting holes, internal copper trace wiring, UL94 V-0 flame retardant substrate
- Description
- Specification
- Application
- FAQS
This edge finger PCB is a standard plug-in circuit board widely used for equipment signal docking. The exposed contact strips at the bottom adopt professional gold electroplating surface craft. A compact nickel underlayer is pre-deposited before gold coating, which greatly strengthens the bonding force of the gold layer. The thick hard gold plating effectively resists oxidation, corrosion and abrasion caused by repeated plugging, while maintaining ultra-low contact resistance to guarantee stable high-speed signal transmission without attenuation.
Pre-reserved central mounting hole and positioning notches enable quick fixed installation inside equipment housings. Internal precisely etched copper traces realize circuit signal routing. Ordinary bare copper or tin-plated PCBs easily oxidize and produce poor contact after long-term plugging, which leads to signal interruption. We integrate PCB substrate manufacturing and gold electroplating finishing as a complete process. All contact surfaces go through multi-stage cleaning and activation before electroplating to avoid missing plating or coating peeling. After plating, full electrical continuity and plating thickness inspection are carried out to ensure precise plug-in matching with corresponding female sockets. The hard gold plating layer maintains intact surface after thousands of plug cycles. When customers adjust the equipment interface structure, we only need to revise PCB layout files, and synchronously adjust electroplating parameters to match new equipment iteration demands.
| Item | Specification |
|---|---|
| Core Craft | FR-4 PCB Fabrication + Edge Finger Gold Electroplating |
| Raw Material | UL94 V-0 FR-4 Base Material, Copper Foil, Green Solder Mask, Nickel Base + Hard Gold Plating |
| Dimensional Tolerance | ±0.08 mm |
| Minimum Gold Thickness on Fingers | 0.6μm Hard Gold |
| Delivery Cycle | 3 working days after Gerber file confirmation |
| Available Post Finish | Full finger gold plating, selective thickened gold plating, laser marking part numbers |
| Electrical & Anti-Corrosion Performance | Contact resistance ≤5mΩ, passes 48-hour neutral salt spray test |