CIXIN MACHINERY TECHNOLOGY
High-Performance Heat Sink Module
This compact and efficient heat dissipation component features aluminum fins and a spring-supported structure, ensuring stable heat dissipation during continuous operation. It is suitable for high-power electronic devices and industrial control systems.
- Thermal Efficiency: Optimized fin arrangement ensures maximum heat dissipation.
- Structural Stability: Spring-mounted design accommodates thermal expansion.
- Precision Assembly: CNC-machined components guarantee dimensional accuracy.
- Material Quality: High-grade aluminum for consistent thermal conductivity.
- Production Flexibility: Suitable for both prototyping and large-scale manufacturing.
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- Description
- Specification
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- FAQS
This heat dissipation module achieves stable heat flow and efficient heat dissipation through optimized aluminum fin arrangement and spring support. The product structure is precisely designed to balance mechanical strength and thermal conductivity, while ensuring thermal stability under high loads. The spring mounting system mitigates thermal expansion stress, preventing component damage caused by thermal cycling.
CNC machining and high-precision assembly ensure dimensional consistency and performance reliability for each module. This component is widely applicable to communication equipment, high-performance computing modules, and industrial automation control units, providing customers with mass-producible and customizable heat dissipation solutions.
| Parameter | Description |
| Process Accuracy | ±0.02–0.05 mm depending on feature complexity |
| Materials | Aluminum alloys |
| Surface Finish | Brushed or anodized (optional) |
| Feature Types | Thin fins, mounting holes, spring supports |
| Max Workpiece Size | 450 mm × 120 mm × 60 mm |
| Batch Runs | Prototype → Small batch → Volume |
| Lead Time | 10–15 working days depending on complexity |
- Electronics: High-power computing modules, communication devices.
- Industrial Equipment: Automation controllers, motor drives.
- LED Systems: High-brightness lighting modules.
- Power Supplies: Converters and inverters requiring stable thermal management.
Q1: What is the maximum power this heat sink can handle?
The module is designed to manage heat dissipation for high-power electronics up to 500 W, depending on airflow and thermal interface.
Q2: Can the fin spacing be customized?
Yes, fin spacing and height can be tailored to optimize thermal performance for specific applications.
Q3: Are the components corrosion-resistant?
The aluminum is anodized or surface-treated to provide corrosion resistance and long-term durability.
Q4: Is this module suitable for mass production?
Yes, the design supports both prototyping and scalable production runs with consistent quality.
Q5: Can the module be integrated into pre-existing systems?
Yes, modular mounting and standardized dimensions allow for easy integration into various electronic and industrial systems.
